Samsung Electronics announced that it has begun mass producing its 128-gigabit (Gb), 3bit multi-level-cell (MLC) NAND memory chip using 10 nanometer (nm)-class* process technology this month. The highly advanced chip will enable high-density memory solutions such as embedded NAND storage and solid state drives (SSDs).
Samsung’s 128Gb NAND flash is based on a 3bit multi-level-cell design and 10nm-class process technology. It boasts the industry’s highest density as well as the highest performance level of 400 megabits-per-second (mbps) data transfer rate based on the toggle DDR 2.0 interface.
Utilizing 128Gb NAND flash memory, Samsung will expand its supply of 128-gigabyte (GB) memory cards, which can store as many as sixteen 8GB full HD video files. Samsung now will also increase its production volume of SSDs with densities over 500GBs for wider adoption of SSDs in computer systems, while leading the transition of main storage drives in the notebook market from hard disk drives (HDDs) to SSDs.
Demand for high-performance 3bit MLC NAND flash and 128Gb high storage capacities has been rapidly increasing, driving the adoption of SSDs with more than 250GB data storage, led by the Samsung SSD 840 Series.
Samsung started production of 10nm-class 64Gb MLC NAND flash memory in November last year, and in less than five months, has added the new 128Gb NAND flash to its wide range of high-density memory storage offerings. The new 128Gb chip also extends Samsung’s 3bit NAND memory line-up along with the 20nm-class* 64Gb 3bit NAND flash chip that Samsung introduced in 2010. Further, the new 128Gb 3bit MLC NAND chip offers more than twice the productivity of a 20nm-class 64Gb MLC NAND chip.
Samsung plans to keep introducing leading-edge SSDs and embedded memory storage solutions with high-quality features, in accelerating the growth of the premium memory market.
*10nm-class means a process technology node somewhere between 10 and 20 nanometers.
**20nm-class means a process technology node somewhere between 20 and 30 nanometers.
***All functionality, features, specifications and other product information provided in this document including, but not limited to, the benefits, design, pricing, components, performance, availability, and capabilities of the product are subject to change without notice or obligation.