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  • ISOCELL Technology: High Resolution Imaging in the Slimmest Devices Yet
    ISOCELL Technology: High Resolution Imaging in the Slimmest Devices Yet
    July 29, 2015

      As mobile devices get thinner, the components inside them must scale down, too. Samsung’s latest chip, the 1.0μm-pixel-based 16 megapixel (MP) CMOS image sensor, did exactly that. It brings high resolution imaging to one of the slimmest smartphones in the market.   Image sensors hold an array of pixels, or pockets that collect light […]

  • Eight Major Steps to Semiconductor Fabrication, Part 9: Packaging and Package Testing
    Eight Major Steps to Semiconductor Fabrication, Part 9: Packaging and Package Testing
    June 17, 2015

    In the previous part of the series, we discussed electrical die sorting (EDS), one of the last stages of semiconductor fabrication. Today, we will cover the packaging and package testing processes as we wrap up our series and ship off our completed semiconductor.   Plugs with Pins and Protection from Dings   Semiconductor packaging involves […]

  • Eight Major Steps to Semiconductor Fabrication, Part 8: Electrical Die Sorting (EDS)
    Eight Major Steps to Semiconductor Fabrication, Part 8: Electrical Die Sorting (EDS)
    June 10, 2015

    In the previous part of our series, we explored the metal interconnect process which ensures a semiconductor’s electronic elements are well-connected so that the appropriate signals can reach where they need to.   It’s been a lengthy process, and we’ve just about completed the fabrication of our semiconductor, but in order to see if our […]

  • Eight Major Steps to Semiconductor Fabrication, Part 7: The Metal Interconnect
    Eight Major Steps to Semiconductor Fabrication, Part 7: The Metal Interconnect
    June 3, 2015

    In the last part of our series, we went over the thin-film process in which a semiconductor chip gets its electrical properties. But we need to ensure that these electronic elements are well-connected and “powered” so that the appropriate signals can reach where they need to. This is achieved during the metal interconnect process, which […]

  • Eight Major Steps to Semiconductor Fabrication, Part 6: The Addition of Electrical Properties
    Eight Major Steps to Semiconductor Fabrication, Part 6: The Addition of Electrical Properties
    May 27, 2015

    Did you know that semiconductors are miniature high-rise buildings?   If you get a chance to see a cross section of a semiconductor chip under a high-resolution electron microscope, you will see layer after layer of materials piled up like a skyscraper.   To fabricate such structures, the photolithography and etching processes (which we discussed previously), […]

  • Eight Major Steps to Semiconductor Fabrication, Part 5: Etching a Circuit Pattern
    Eight Major Steps to Semiconductor Fabrication, Part 5: Etching a Circuit Pattern
    May 20, 2015

    In the previous part of the series, we covered the photolithography, or “photo,” process in which circuit patterns were drawn on the wafer surface. Now, the wafer is ready go through the etching process to have any unnecessary materials removed so that only the desired patterns remain on its exterior.   An art in itself   […]

  • Eight Major Steps to Semiconductor Fabrication, Part 4: Drawing Structures in Nano-Scale
    Eight Major Steps to Semiconductor Fabrication, Part 4: Drawing Structures in Nano-Scale
    May 13, 2015

    In the previous part of this series, our wafer got a protective layer of silicon oxide added to its surface. Now, let’s move on and find out about the photolithography process, through which electronic circuit patterns are transferred onto the wafer.   Before people began to take pictures with digital cameras or smartphones, there were […]

  • Eight Major Steps to Semiconductor Fabrication, Part 3: The Integrated Circuit
    Eight Major Steps to Semiconductor Fabrication, Part 3: The Integrated Circuit
    May 6, 2015

    In the previous part of this series, we explained how an oxide layer is formed and protects the wafer’s surface against impurities. Since the wafer is now protected with a silicon dioxide (SiO2) layer, it is ready to be imprinted with the circuit pattern, which contains the numerous densely packed electronic components such as transistors, diodes, […]

  • Eight Major Steps to Semiconductor Fabrication, Part 2: The Oxidation Process
    Eight Major Steps to Semiconductor Fabrication, Part 2: The Oxidation Process
    April 29, 2015

    In the previous part of this series, we discussed the manufacturing process of the wafer, an indispensable part of a semiconductor integrated circuit. Continuing onto the next step of the disc production stage, we will delve into the oxidation process that produces a thin layer of silicon dioxide (SiO2).   A reliable oxide layer that […]

  • Eight Major Steps to Semiconductor Fabrication, Part 1: Creating the Wafer
    Eight Major Steps to Semiconductor Fabrication, Part 1: Creating the Wafer
    April 22, 2015

      Although an integrated circuit (IC), also known as a semiconductor chip, may deceive you with its fingernail-sized form factor, it is actually packed with billions of electronic components—transistors, diodes, resistors, and capacitors—which all work together to perform logic operations and store data.   So, what does it take to manufacture this kind of circuit, […]



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